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Inspecting Your Mainboard
bunnie edited this page Feb 10, 2022
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Before using your device, you may want to have a look at the mainboard to ensure its correct construction.
Here is an overview of the components on the mainboard.
That's a lot of detail, so we've created a point-by-point guide of the "trusted domain" and the regions to look at, and why they are interesting.
- Avalanche generator TRNG. While there are continuously running statistical tests to ensure it is operating properly, modifications to this can greatly impact security properties of the underlying software.
- Battery-backed AES key regulator. The test point on the left edge can be used to defeat the self destruct mechanism.
- FLASH memory. The part number should be MX66UM1G45G. When examined under X-ray, you may see two stacked die inside. This is normal.
- AES kill key latch. This is a discrete circuit that shuts down the battery backed AES key regulator and battery-backed RAM supply in the event of a self destruct. The red LED will turn on when this is activated. The circuit will not de-activate until the battery is cut.
- 1.8V domain regulators. They supply power to the RAM and on-chip block RAM on the FPGA. Glitches here can corrupt OS state. 6a & 6b. SRAM chips. the part number should be IS66WVE4M16EALL-70BLI
- SRAM ZZ isolation circuit. This is normally used during standby to prevent RAM corruption, but can be abused in normal operation to intentionally corrupt RAM.
- SRAM CE isolation circuit. This is normally used during standby to prevent RAM corruption, but can be abused in normal operation to intentionally corrupt RAM.
- RTC module. The markings on this module unfortunately are not fully specified by the vendor.
- Power glitch & active discharge circuit. The circuits here will reset the SOC in case of a power glitch on the power that feeds the self destruct circuit, and there are also FETs that actively discharge the power rails so in case of a shutdown it is rapid and complete.
- JTAG pins. Any Starbleed/WBSTAR exploit would require access to this bank of pins in particular.
- SoC core voltage supply and mains switches. Glitches on the core voltage supply can disrupt SoC function.
- Main FPGA that implements the SoC function. The part number should be XC7S50.
There should be no additional fly-wires or components present beyond the ones enumerated here.
An unmarked version of the reference image can be downloaded here.
For those fortunate to have access to an X-ray machine, here are some reference images of a near-final production board.