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Hi,
This is not a issue, but a disscussion.
I would like to have two RDMA VFs in a single container and build bond device on top of it. Is it feasible ?
If it is, are there any limitations of current implementation? By limitiations, I mean for example:
Thanks!
The text was updated successfully, but these errors were encountered:
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Hi,
This is not a issue, but a disscussion.
I would like to have two RDMA VFs in a single container and build bond device on top of it. Is it feasible ?
If it is, are there any limitations of current implementation? By limitiations, I mean for example:
Thanks!
The text was updated successfully, but these errors were encountered: